Sanka Ganesan

This inventor holds 62 USPTO granted patents and 25 published patent applications and 3 EPO patents, primarily in Semiconductor Packaging. Top assignee: Intel Corporation. Active years: 2010-2026. Education: University of Arizona (USA).

Graduated from:

University of Arizona (USA)

USPTO Granted Patents = 62 (Patent Applications = 25)

% Patents Active = 77.4

EPO Patents = 3 (Patent Applications = 15)

Average Co-Inventor Count = 4.3

ph-index = 8

Forward Citations = 283(Granted Patents)

Forward Citations (Not Self Cited) = 231(Dec 10, 2025)

Company Filing History:

62 out of 56,222

Intel Corporation

patents

Years Active: 2010-2026

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Areas of Expertise:

Semiconductor Packaging

Embedded Die Architecture

Thermal Management

Ultra-Thin Designs

High Density Interconnects

Microelectronic Assemblies

Integrated Circuit Packages

3D Die Stacking

Direct Chip Attach

Molded Regions

Interposer Package

Ultra-Small Systems

62 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12696520 - Coupled inductors with GaN switches in GaN 3D power block (2026-07-28),

2. 12669659 - Optical packaging using embedded-in-mold (EIM) optical module integration (2026-06-30),

3. 12557675 - Inorganic redistribution layer on organic substrate in integrated circuit packages (2026-02-17),

4. 12476174 - Ultra-thin, hyper-density semiconductor packages (2025-11-18),

5. 12406914 - Ultra-thin, hyper-density semiconductor packages (2025-09-02),

6. 12387999 - Planar integrated circuit package interconnects (2025-08-12),

7. 12368089 - Low cost embedded integrated circuit dies (2025-07-22),

8. 12347782 - Microelectronic assemblies with direct attach to circuit boards (2025-07-01),

9. 12334242 - Coreless electronic substrates having embedded inductors (2025-06-17),

10. 12261124 - Embedded die architecture and method of making (2025-03-25),

11. 12176292 - Microelectronic component having molded regions with through-mold vias (2024-12-24),

12. 12170273 - Integrated circuit assemblies with direct chip attach to circuit boards (2024-12-17),

13. 12142568 - Multi-die ultrafine pitch patch architecture of interconnect bridge over glass layer and method of making (2024-11-12),

14. 11978727 - Package on active silicon semiconductor packages (2024-05-07),

15. 11869842 - Scalable high speed high bandwidth IO signaling package architecture and method of making (2024-01-09),

Title: Sanka Ganesan: Innovator in Power Electronics and Optical Packaging

Introduction

Sanka Ganesan is a prominent inventor based in Chandler, AZ (US), known for his significant contributions to the fields of power electronics and optical packaging. With an impressive portfolio of 62 patents, Ganesan has made notable advancements that have impacted various technological applications.

Latest Patents

Among his latest innovations, Ganesan has developed a coupled inductor with GaN switches in a GaN 3D power block. This invention includes a coupled inductor comprising a first and a second inductor, with switches that utilize gallium and nitrogen. Another significant patent involves optical packaging using embedded-in-mold (EIM) optical module integration. This optical module features an electronic integrated circuit, a photonic integrated circuit, and a pluggable optical coupling connector, all embedded in a mold to enhance functionality and efficiency.

Career Highlights

Sanka Ganesan is currently employed at Intel Corporation, where he continues to push the boundaries of innovation in technology. His work at Intel has allowed him to collaborate with other talented engineers and researchers, further enhancing the impact of his inventions.

Collaborations

Some of his notable coworkers include Robert L Sankman and Debendra Mallik, who have contributed to various projects alongside Ganesan.

Conclusion

Sanka Ganesan's work exemplifies the spirit of innovation in the technology sector. His patents and contributions continue to shape the future of power electronics and optical systems.