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For the Inventor, By the Inventor

Sanka Ganesan

Chandler, AZ, United States of America

Sanka Ganesan

LinkedIn
Graduated from:
  • University of Arizona (USA)
USPTO Granted Patents = 59 

 

Average Co-Inventor Count = 4.3

ph-index = 8

Forward Citations = 267(Granted Patents)

Forward Citations (Not Self Cited) = 231(Dec 10, 2025)


Company Filing History:

goldMedal59 out of 54,750 
 
Intel Corporation
 patents

Years Active: 2010-2025

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Areas of Expertise:
Semiconductor Packages
Microelectronic Assemblies
Integrated Circuit Packages
High Density Interconnects
Embedded Die Architecture
Thermal Management Solutions
Chip Scale Packages
3D Die Stacked Architecture
Planar Integrated Circuit Interconnects
Electronic Package Connections
Interposer Package-on-Package
Scalable Package Architecture
59 patents (USPTO):Explore Patents
1. 12476174 - Ultra-thin, hyper-density semiconductor packages (2025-11-18),
2. 12406914 - Ultra-thin, hyper-density semiconductor packages (2025-09-02),
3. 12387999 - Planar integrated circuit package interconnects (2025-08-12),
4. 12368089 - Low cost embedded integrated circuit dies (2025-07-22),
5. 12347782 - Microelectronic assemblies with direct attach to circuit boards (2025-07-01),
6. 12334242 - Coreless electronic substrates having embedded inductors (2025-06-17),
7. 12261124 - Embedded die architecture and method of making (2025-03-25),
8. 12176292 - Microelectronic component having molded regions with through-mold vias (2024-12-24),
9. 12170273 - Integrated circuit assemblies with direct chip attach to circuit boards (2024-12-17),
10. 12142568 - Multi-die ultrafine pitch patch architecture of interconnect bridge over glass layer and method of making (2024-11-12),
11. 11978727 - Package on active silicon semiconductor packages (2024-05-07),
12. 11869842 - Scalable high speed high bandwidth IO signaling package architecture and method of making (2024-01-09),
13. 11817390 - Microelectronic component having molded regions with through-mold vias (2023-11-14),
14. 11804426 - Integrated circuit structures in package substrates (2023-10-31),
15. 11756889 - Ultrathin bridge and multi-die ultrafine pitch patch architecture and method of making (2023-09-12),

Title: **The Innovative Mind of Sanka Ganesan**

Introduction

Sanka Ganesan, an accomplished inventor based in Chandler, AZ, has made significant contributions to the field of semiconductor technology. With an impressive portfolio of 53 patents, he has established himself as a leader in innovation, particularly within his role at Intel Corporation.

Latest Patents

Among Sanka Ganesan's latest inventions are patents focused on advanced semiconductor packaging techniques. One notable patent is for an "Embedded die architecture and method of making," which presents a versatile semiconductor package design. This package comprises a substrate with two opposed major surfaces and a bridge die, enhancing the connection of electronic components via a through-silicon via that extends through the substrate. Additionally, his patent for a "Microelectronic component having molded regions with through-mold vias" further exemplifies his expertise. This patent discusses innovative microelectronic assemblies that integrate through-substrate vias and conductive mold material regions to enhance performance and reliability.

Career Highlights

Sanka Ganesan's career has been marked by his tenure at Intel Corporation, where he has been instrumental in the development of cutting-edge technologies. His work has facilitated advancements in microelectronics, driving forward the capabilities of semiconductor devices used in various applications, from consumer electronics to industrial equipment.

Collaborations

Throughout his career, Sanka has collaborated with fellow innovators such as Robert L Sankman and Debendra Mallik. These partnerships have resulted in groundbreaking technologies that push the boundaries of what is possible in semiconductor design and integration.

Conclusion

In summary, Sanka Ganesan stands out as a prominent figure in the realm of inventions, particularly within semiconductor technology. His relentless pursuit of innovation and collaboration with leading minds in the field ensures that he will continue to make profound impacts in the industry for years to come.

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