The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2025
Filed:
Sep. 15, 2021
Intel Corporation, Santa Clara, CA (US);
Sanka Ganesan, Chandler, AZ (US);
William J. Lambert, Chandler, AZ (US);
Bharat Prasad Penmecha, Phoenix, AZ (US);
Xavier Francois Brun, Hillsboro, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first redistribution layer (RDL), having a first surface with first conductive contacts having a first pitch between 170 microns and 400 microns, an opposing second surface, and first conductive pathways between the first and second surfaces; a first die and a conductive pillar in a first layer on the first RDL; a second RDL on the first layer, the second RDL having a first surface, an opposing second surface with second conductive contacts having a second pitch between 18 microns and 150 microns, and second conductive pathways between the first and second surfaces; and a second die, in a second layer on the second RDL, electrically coupled to the first conductive contacts via the first conductive pathways, the conductive pillar, the second conductive pathways, and the second conductive contacts.