Chandler, AZ, United States of America

James Chris Matayabas, Jr

This inventor holds 47 USPTO granted patents and 10 published patent applications, primarily in Thermal Management. Top assignee: Intel Corporation. Active years: 2002-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: James Chris Matayabas, Jr. Retrieved from https://idiyas.com/inventor/james-chris-matayabas-jr

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 47 

% Patents Active = 25.5

Average Co-Inventor Count = 2.4

ph-index = 9

Forward Citations = 324(Granted Patents)


Location History:

  • Chandler, AZ (US) (2002 - 2018)
  • Gilbert, AZ (US) (2015 - 2024)

Company Filing History:


Years Active: 2002-2024

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Areas of Expertise:
Thermal Management
Microelectronic Packaging
Polymer Interface Materials
Heat Spreaders
Thermal Conductivity
Integrated Circuit
Solder Paste
Carbon Nanotubes
Dielectric Film
Thermoset Polyimides
Multi-Chip Packages
Electromagnetic Interference
47 patents (USPTO):Explore Patents

Title: James Chris Matayabas, Jr.: Innovator in Thermal Interface Materials

Introduction

James Chris Matayabas, Jr. is a prolific inventor based in Chandler, AZ, with an impressive record of 45 patents to his name. His work primarily focuses on advancements in microelectronic devices and materials that enhance thermal conduction. As a significant contributor to Intel Corporation, he is at the forefront of innovation in the electronics industry.

Latest Patents

Among his latest innovations, Matayabas has developed groundbreaking technologies such as carbon-based polymer thermal interface materials. This invention introduces a composite material designed to efficiently conduct heat from microelectronic dies. The innovative material incorporates polymer chains that are chemically bonded to fill particles featuring a hexagonal lattice of carbon atoms, such as graphene sheets and carbon nanotubes.

Another notable patent involves an integrated heat spreader that comprises a silver and sintering silver layered structure. This apparatus includes a die with an integrated circuit and multiple layers of materials, strategically designed to optimize heat distribution. The design incorporates a third layer made of silver particles characterized by higher porosity, effectively enhancing the thermal performance of electronic components.

Career Highlights

Matayabas's expertise in materials science and engineering has been vital to his role at Intel Corporation. His contributions have not only expanded the company’s portfolio but have also set new benchmarks in thermal management solutions in the field of microelectronics. His commitment to research and development has solidified his status as a key figure in innovative technology.

Collaborations

In his pursuit of innovation, Matayabas has collaborated with esteemed colleagues such as Nachiket R Raravikar and Paul A Koning. These partnerships have facilitated a blend of expertise, allowing for the cross-pollination of ideas and the development of cutting-edge technologies that enhance the performance of microelectronic devices.

Conclusion

James Chris Matayabas, Jr. continues to push the boundaries of innovation in thermal interface materials and microelectronics at Intel Corporation. With 45 patents to his credit, his contributions significantly impact the efficiency and effectiveness of heat management in electronic devices. As technology evolves, his ongoing research and inventions promise to lead the industry into new territories of advancement.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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