The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2023

Filed:

Mar. 08, 2019
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Elizabeth Nofen, Phoenix, AZ (US);

James C. Matayabas, Jr., Gilbert, AZ (US);

Yawei Liang, Chandler, AZ (US);

Yiqun Bai, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 23/367 (2006.01); F28F 21/08 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); F28F 21/085 (2013.01); F28F 21/089 (2013.01); H01L 21/4882 (2013.01); H01L 23/3675 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/1434 (2013.01);
Abstract

An apparatus is provided which comprises: a die comprising an integrated circuit, a first material layer comprising a first metal, the first material layer on a surface of the die, and extending at least between opposite lateral sides of the die, a second material layer comprising a second metal over the first material layer, and a third material layer comprising silver particles and having a porosity greater than that of the second material layer, the third material layer between the first material layer and the second material layer. Other embodiments are also disclosed and claimed.


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