The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2022
Filed:
Dec. 07, 2016
Intel Corporation, Santa Clara, CA (US);
Nachiket R. Raravikar, Saratoga, CA (US);
Ravindranath V. Mahajan, Chandler, AZ (US);
Robert L. Sankman, Phoenix, AZ (US);
James C. Matayabas, Jr., Gilbert, AZ (US);
Ken P. Hackenberg, Tempe, AZ (US);
Nayandeep K. Mahanta, Minneapolis, MN (US);
David D. Olmoz, Gilbert, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
In some embodiments a semiconductor die package includes a package substrate, a plurality of dies each attached to the package substrate, a layer of a thermally conducting sintered paste over the top of each die, a layer of flexible polymer thermal interface material over the sintered paste, and a heat spreader over and thermally connected to the polymer thermal interface material.