The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2017
Filed:
Dec. 11, 2013
Intel Corporation, Santa Clara, CA (US);
Sasha Oster, Chandler, AZ (US);
Robert L. Sankman, Phoenix, AZ (US);
Charles Gealer, Phoenix, AZ (US);
Omkar Karhade, Chandler, AZ (US);
John S. Guzek, Chandler, AZ (US);
Ravi V. Mahajan, Chandler, AZ (US);
James C. Matayabas, Jr., Chandler, AZ (US);
Johanna Swan, Scottsdale, AZ (US);
Feras Eid, Chandler, AZ (US);
Shawna Liff, Gilbert, AZ (US);
Timothy McIntosh, Phoenix, AZ (US);
Telesphor Kamgaing, Chandler, AZ (US);
Adel Elsherbini, Chandler, AZ (US);
Kemal Aygun, Tempe, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
This disclosure relates generally to devices, systems, and methods for making a flexible microelectronic assembly. In an example, a polymer is molded over a microelectronic component, the polymer mold assuming a substantially rigid state following the molding. A routing layer is formed with respect to the microelectronic component and the polymer mold, the routing layer including traces electrically coupled to the microelectronic component. An input is applied to the polymer mold, the polymer mold transitioning from the substantially rigid state to a substantially flexible state upon application of the input.