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For the Inventor, By the Inventor

Tempe, AZ, United States of America

Ravi V Mahajan

This inventor holds 35 USPTO granted patents and 3 published patent applications, primarily in Microelectronic Packaging. Top assignee: Intel Corporation. Active years: 1998-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ravi V Mahajan. Retrieved from https://idiyas.com/inventor/ravi-v-mahajan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 35 

% Patents Active = 77.1

Average Co-Inventor Count = 3.2

ph-index = 15

Forward Citations = 827(Granted Patents)


Location History:

  • Tempte, AZ (US) (2002)
  • Phoenix, AZ (US) (2009)
  • Tempe, AZ (US) (1998 - 2015)
  • Chandler, AZ (US) (2011 - 2024)

Company Filing History:

goldMedal35 out of 56,322 
 
Intel Corporation
 patents

Years Active: 1998-2024

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Areas of Expertise:
Microelectronic Packaging
High Density Substrates
Thermal Management
Cooling Solutions
Integrated Circuit Packages
Fluid Cooling
Electromagnetically-Actuated Micropump
Micro-Channel Heat Exchangers
Electronic Assembly
Three-Dimensional Interconnection
EMI Containment
Flip-Chip Devices
35 patents (USPTO):Explore Patents
1. 12107042 - Localized high density substrate routing (2024-10-01),
2. 11984396 - Localized high density substrate routing (2024-05-14),
3. 11515248 - Localized high density substrate routing (2022-11-29),
4. 10796988 - Localized high density substrate routing (2020-10-06),
5. 9941246 - Electronic assembly that includes stacked electronic devices (2018-04-10),
6. 9941245 - Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate (2018-04-10),
7. 9820384 - Flexible electronic assembly method (2017-11-14),
8. 9269701 - Localized high density substrate routing (2016-02-23),
9. 9136236 - Localized high density substrate routing (2015-09-15),
10. RE44629 - Process for assembling an integrated circuit package having a substrate vent hole (2013-12-09),
11. 8441809 - Microelectronic package containing silicon connecting region for high density interconnects, and method of manufacturing same (2013-05-14),
12. 8064224 - Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same (2011-11-22),
13. 7882624 - Method of forming electronic package having fluid-conducting channel (2011-02-08),
14. 7851905 - Microelectronic package and method of cooling an interconnect feature in same (2010-12-14),
15. 7764499 - Electromagnetically-actuated micropump for liquid metal alloy (2010-07-27),

Title: **Ravi V Mahajan: A Pioneer in High Density Substrate Routing**

Introduction

Ravi V Mahajan is a prominent inventor based in Tempe, AZ, known for his innovative contributions in the field of electronics. With an impressive portfolio of 33 patents, he has significantly advanced the technology surrounding high-density substrate routing. His work has had a profound impact on optimizing electronic circuitry and improving overall device performance.

Latest Patents

One of Ravi's latest patents focuses on **Localized High Density Substrate Routing**. This invention describes a system and methods for localized routing, which enable enhanced performance of circuit elements. The apparatus includes a medium with low density routing, first and second circuitry elements, an interconnect element, and a dielectric layer. The interconnect element is embedded in the medium and features a plurality of electrically conductive members that connect the first and second circuitry elements. This innovative approach allows for high-density routing while maintaining efficiency and functionality in electronic devices.

Career Highlights

Ravi V Mahajan currently works for Intel Corporation, where he applies his expertise to push the boundaries of electronic design and engineering. His extensive background in patent development not only highlights his innovative skills but also showcases his commitment to advancing technology within the company and the broader industry.

Collaborations

Throughout his career, Ravi has collaborated with esteemed colleagues such as Robert Starkston and John Stephen Guzek. Together, they have contributed to several cutting-edge projects, enhancing the capabilities and performance of electronic devices.

Conclusion

Ravi V Mahajan's contributions to electronics, particularly in high-density substrate routing, demonstrate his dedication to innovation. With 33 patents to his name, he continues to be an influential figure in the field, shaping the future of electronic design and functionality. As technology evolves, Ravi's work at Intel Corporation remains pivotal in driving advancements that benefit multiple industries.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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