The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2013
Filed:
Nov. 29, 2004
Applicants:
Suresh Ramalingam, Fremont, CA (US);
Nagesh Vodrahalli, Los Altos, CA (US);
Michael J. Costello, Chandler, AZ (US);
Mun Leong Loke, Bukit Mertajam, MY;
Ravi V. Mahajan, Tempe, AZ (US);
Inventors:
Suresh Ramalingam, Fremont, CA (US);
Nagesh Vodrahalli, Los Altos, CA (US);
Michael J. Costello, Chandler, AZ (US);
Mun Leong Loke, Bukit Mertajam, MY;
Ravi V. Mahajan, Tempe, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2005.12);
U.S. Cl.
CPC ...
Abstract
The present invention involves a method of providing an integrated circuit package having a substrate with a vent opening. The integrated circuit package includes a substrate having an opening and an integrated circuit mounted to the substrate. An underfill material is dispensed between the substrate and the integrated circuit.