For the Inventor, By the Inventor

Enter inventor name

Fremont, CA, United States of America

Suresh Ramalingam

USPTO Granted Patents = 63 (Patent Applications = 12)

EPO Patents = 5 (Patent Applications = 6)

Average Co-Inventor Count = 3.2

ph-index = 13

Forward Citations = 631(Granted Patents)

Forward Citations (Not Self Cited) = 579(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

46 out of 5,008

10 out of 54,750

Intel Corporation

Jds Uniphase Corporation

5. 1 out of 12,883

Advanced Micro Devices Corporation

Years Active: 2001-2025

Loading Chart...

Loading Chart...

Areas of Expertise:

Chip Packaging

Thermal Management

Integrated Circuits

Silicon Package Assembly

Heat Dissipation

Interconnect Technology

Multi-Chip Packaging

Thermal Interface Materials

Electronic Device Cooling

3D Integration

ESD Protection

Through-Silicon Vias

63 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12463143 - Chip package with core embedded integrated devices (2025-11-04),

2. 12324101 - Frame for coupling of a thermal management device to a printed circuit board (2025-06-03),

3. 12315781 - Heat spreader for a semiconductor package (2025-05-27),

4. 12136613 - Chip package with near-die integrated passive device (2024-11-05),

5. 12027493 - Fanout integration for stacked silicon package assembly (2024-07-02),

6. 11769710 - Heterogeneous integration module comprising thermal management apparatus (2023-09-26),

7. 11605886 - Radome with integrated passive cooling (2023-03-14),

8. 11488936 - Stacked silicon package assembly having vertical thermal management (2022-11-01),

9. 11488887 - Thermal enablement of dies with impurity gettering (2022-11-01),

10. 11476556 - Remote active cooling heat exchanger and antenna system with the same (2022-10-18),

11. 11373989 - Package integration for laterally mounted IC dies with dissimilar solder interconnects (2022-06-28),

12. 11373929 - Thermal heat spreader plate for electronic device (2022-06-28),

13. 11355412 - Stacked silicon package assembly having thermal management (2022-06-07),

14. 11330738 - Force balanced package mounting (2022-05-10),

15. 11328976 - Three-dimensional thermal management apparatuses for electronic devices (2022-05-10),

Title: Suresh Ramalingam - Innovator from Fremont, CA

Introduction: Suresh Ramalingam is a renowned inventor based in Fremont, California, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Suresh Ramalingam holds several patents in the areas of artificial intelligence, renewable energy, and medical devices, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With over two decades of experience in the tech industry, Suresh has worked with leading companies to develop cutting-edge solutions that have revolutionized various sectors.

Collaborations: Throughout his career, Suresh Ramalingam has collaborated with top researchers, engineers, and scientists to bring his ideas to life, fostering a culture of innovation and creativity in the teams he works with.

Conclusion: Suresh Ramalingam's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and entrepreneurs in the ever-evolving tech landscape.

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to support@idiyas.com

Loading…