The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2023

Filed:

Dec. 23, 2020
Applicant:

Xilinx, Inc., San Jose, CA (US);

Inventors:

Gamal Refai-Ahmed, Santa Clara, CA (US);

Chi-Yi Chao, New Taipei, TW;

Lik Tsang, Kowloon, HK;

Jens Weis, Dresden, DE;

Brendan Farley, Dublin, IE;

Anthony Torza, Oakland, CA (US);

Suresh Ramalingam, Fremont, CA (US);

Assignee:

XILINX, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/42 (2006.01); H01L 23/427 (2006.01); H01Q 1/02 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/42 (2013.01); H01L 23/427 (2013.01); H01Q 1/02 (2013.01);
Abstract

An antenna assembly is provided having passive cooling elements that enable compact design. In one example, an antenna assembly is provided that includes a heat sink assembly having an interior side and an exterior side, an antenna array, an antenna circuit board, and a radome. The antenna circuit board includes at least one integrated circuit (IC) die. The IC die has a conductive primary heat dissipation path to the interior side of the heat sink assembly. The radome is coupled to the heat sink assembly and encloses the antenna circuit board and the antenna array between the radome and the heat sink assembly. The heat sink assembly includes a metal base plate and at least a first heat pipe embedded with the metal base plate. The first heat pipe is disposed between the metal base plate and the IC die.


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