The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 03, 2025

Filed:

Mar. 14, 2023
Applicant:

Advanced Micro Devices, Inc., Santa Clara, CA (US);

Inventors:

Gamal Refai-Ahmed, Santa Clara, CA (US);

Suresh Ramalingam, Fremont, CA (US);

Aslam Yehia, San Jose, CA (US);

Chi-Yi Chao, New Taipei, TW;

Md Malekkul Islam, San Jose, CA (US);

Hoa Do, San Jose, CA (US);

Assignee:

Advanced Micro Devices, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 5/00 (2006.01); H05K 7/10 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 5/0026 (2013.01); H05K 7/10 (2013.01); H05K 7/20836 (2013.01);
Abstract

An electronic device having a frame for coupling a plurality of thermal management devices to the printed circuit board is provided. The electronic device includes a first chip package mounted to the PCB and a second chip package mounted to the PCB. The frame is secured to the PCB, and the frame has a first aperture disposed over the first chip package and a second aperture disposed over the second chip package. The plurality of thermal management devices coupled to the frame includes a first thermal management device contacting an IC die of the first chip package through the first aperture and a second thermal management device contacting an IC die of the second chip package through the second aperture.


Find Patent Forward Citations

Loading…