The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2026
Filed:
Jan. 06, 2021
Xilinx, Inc., San Jose, CA (US);
Huayan Wang, Campbell, CA (US);
Seungbae Park, Vestal, NY (US);
Gamal Refai-Ahmed, Santa Clara, CA (US);
Suresh Ramalingam, Fremont, CA (US);
Jaspreet Singh Gandhi, San Jose, CA (US);
Yu Hsiang Sun, Hsin Chu, TW;
Scott Mccann, Sunnyvale, CA (US);
XILINX, INC., San Jose, CA (US);
Abstract
Disclosed herein is a package substrate and a method for fabricating the same. In one example, a package substrate includes a core having an outer edge and a first plurality of first interconnect layers disposed on the core. The first plurality of interconnect layers disposed on the core include an outermost dielectric layer disposed farthest from the core. The outermost dielectric layer has an edge that is recessed from the edge of the core.