Company Filing History:
Years Active: 2022
Title: Innovations of Yu Hsiang Sun in Chip Package Assembly
Introduction
Yu Hsiang Sun is an accomplished inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of chip package assembly, particularly focusing on enhancing solder resist crack resistance. His innovative approach has the potential to improve the reliability and performance of electronic devices.
Latest Patents
Yu Hsiang Sun holds a patent for a chip package assembly with enhanced solder resist crack resistance. This patent describes a chip package assembly that features robust solder connections. In one example, the assembly includes an integrated circuit (IC) die and a package substrate. The solder pads are strategically arranged to connect to the pillars of the IC die via solder connections. The design incorporates solder resist in the corners of the package substrate, which helps prevent cracking around the solder connections. This is achieved by isolating the portion of the solder resist surrounding the solder pads and providing an offset between the centerlines of the pillars and solder pads.
Career Highlights
Yu Hsiang Sun is currently employed at Xilinx, Inc., where he continues to develop innovative solutions in the semiconductor industry. His work has contributed to advancements in chip packaging technology, which is crucial for the performance of modern electronic devices.
Collaborations
Some of Yu Hsiang Sun's notable coworkers include Suresh Ramalingam and Tien-Yu Lee. Their collaborative efforts in research and development have further enhanced the innovations in chip package assembly.
Conclusion
Yu Hsiang Sun's contributions to the field of chip package assembly demonstrate his commitment to innovation and excellence. His patent on enhanced solder resist crack resistance showcases his ability to address critical challenges in the semiconductor industry.