Wen-Chih Chiou

Title: Wen-Chih Chiou: A Prolific Innovator in the Field of Interconnect Technology

Introduction:

In the world of innovation and patents, Wen-Chih Chiou has established himself as a highly accomplished inventor. Hailing from Miaoli, Taiwan, Chiou possesses an impressive portfolio of 316 patents, demonstrating his expertise in interconnect technology and related fields. This article will delve into Chiou's latest patents, highlight his career achievements, explore some of his notable collaborations, and underscore his invaluable contributions to the field.

Latest Patents:

Two of Chiou's recent patents have garnered significant attention and showcased his ingenuity in developing advanced interconnect structures and methods. The first patent, "Through Via Structure and Method," describes a technique for forming a trench extending through an interlayer dielectric layer and partly through the substrate. This method enables the precise deposition of conductive material and dielectric overlays, ensuring efficient and reliable interconnectivity.

The second patent, "Interconnect Structure and Method of Forming Same," demonstrates Chiou's expertise in optimizing interconnect structures. This invention involves the integration of active circuits, dielectric layers, pads with distinct compositions, and passivation layers. By employing different materials and embedding pads within the dielectric layer, Chiou has enhanced the overall performance and reliability of interconnects.

Career Highlights:

Chiou's remarkable career encompasses collaborations with esteemed companies at the forefront of technological advancements. He has worked with Taiwan Semiconductor Manufacturing Company Limited (TSMC), a global leader in semiconductor manufacturing. Through his association with TSMC, Chiou has been actively involved in developing cutting-edge interconnect solutions that have revolutionized the industry.

Additionally, Chiou has made significant contributions to TSMC Solid State Lighting Ltd., an affiliate of TSMC specializing in solid-state lighting technologies. His expertise has helped to advance the efficiency and reliability of lighting systems, paving the way for more energy-efficient and sustainable illumination solutions.

Collaborations:

Throughout his career, Chiou has collaborated with various talented professionals, enriching the field of interconnect technology through combined expertise. Two notable coworkers who have worked closely with Chiou are Chen-Hua Yu and Ku-Feng Yang. These collaborations have fostered an environment of innovation and knowledge exchange, resulting in groundbreaking inventions and advancements in the field.

Conclusion:

Wen-Chih Chiou's impressive repertoire of patents, innovative ideas, and advantageous collaborations has solidified his position as a prominent figure in the realm of interconnect technology. With 316 patents to his name, Chiou continues to push the boundaries of what is possible in the pursuit of enhanced interconnectivity and optimal device performance. His contributions to the field have not only earned him acclaim but have also played a pivotal role in shaping the landscape of inventions and patents in the industry.