The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2026

Filed:

Feb. 23, 2023
Applicant:

Advanced Micro Devices, Inc., Santa Clara, CA (US);

Inventors:

Gamal Refai-Ahmed, Santa Clara, CA (US);

Chi-Yi Chao, New Taipei, TW;

MD Malekkul Islam, San Jose, CA (US);

Suresh Ramalingam, Fremont, CA (US);

Paul Theodore Artman, Orlando, FL (US);

Mark Steinke, Austin, TX (US);

Christopher Jaggers, Austin, TX (US);

Assignee:

Advanced Micro Devices, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/427 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/46 (2006.01);
U.S. Cl.
CPC ...
H01L 23/427 (2013.01); H01L 23/367 (2013.01); H01L 23/3732 (2013.01); H01L 23/46 (2013.01);
Abstract

A heat exchanger for a chip package is provided. The heat exchanger includes a body having an upper side, a lower side, and an internal cavity disposed in the body between the upper side and the lower side. A first outlet port and a second outlet port are formed in the body and are in fluid communication with the internal cavity. An inlet port is formed through the upper side of the body between the first and second outlet ports to supply fluid into the internal cavity.


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