The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
Mar. 07, 2022
Applicant:
Xilinx, Inc., San Jose, CA (US);
Inventors:
Gamal Refai-Ahmed, Santa Clara, CA (US);
Yohan Frans, Palo Alto, CA (US);
Suresh Ramalingam, Fremont, CA (US);
Assignee:
XILINX, INC., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 40/73 (2026.01); H10W 40/00 (2026.01); H10W 42/00 (2026.01); H10W 76/40 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 40/73 (2026.01); H10W 40/037 (2026.01); H10W 42/121 (2026.01); H10W 76/40 (2026.01); H10W 90/00 (2026.01);
Abstract
Chip packages and methods for fabricating the same are provided which utilize a first heat spreader interfaced with a first integrated circuit (IC) die and a second heat spreader separately interfaced with a second IC die. The separate heat spreaders allow the force applied to the first IC die to be controlled independent of the force applied to the second IC die.