The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2011
Filed:
Mar. 31, 2008
Applicants:
Ravi Mahajan, Chandler, AZ (US);
Sandeep Sane, Chandler, AZ (US);
Inventors:
Ravi Mahajan, Chandler, AZ (US);
Sandeep Sane, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/02 (2006.01); H01L 21/78 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
A microelectronic package comprises a substrate (), a silicon patch () embedded in the substrate, a first interconnect structure () at a first location of the silicon patch and a second interconnect structure () at a second location of the silicon patch, and an electrically conductive line () in the silicon patch connecting the first interconnect structure and the second interconnect structure to each other.
Mahajan, Ravi. (2011). Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same (U.S. Patent No. 8064224). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8064224
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile