IDiyas

For the Inventor, By the Inventor

Phoenix, AZ, United States of America

Charles A Gealer

USPTO Granted Patents = 17 

Average Co-Inventor Count = 4.6

ph-index = 7

Forward Citations = 283(Granted Patents)


Company Filing History:

goldMedal17 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2000-2022

Loading Chart...
17 patents (USPTO):
1. 11217516 - Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same (2022-01-04),
2. 10555417 - Mainboard assembly including a package overlying a die directly attached to the mainboard (2020-02-04),
3. 10251273 - Mainboard assembly including a package overlying a die directly attached to the mainboard (2019-04-02),
4. 10186480 - Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same (2019-01-22),
5. 9842832 - High density interconnection of microelectronic devices (2017-12-12),
6. 9820384 - Flexible electronic assembly method (2017-11-14),
7. 9666549 - Methods for solder for through-mold interconnect (2017-05-30),
8. 9617148 - Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips (2017-04-11),
9. 9397071 - High density interconnection of microelectronic devices (2016-07-19),
10. 9368429 - Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips (2016-06-14),
11. 9177831 - Die assembly on thin dielectric sheet (2015-11-03),
12. 9159690 - Tall solders for through-mold interconnect (2015-10-13),
13. 7166924 - Electronic packages with dice landed on wire bonds (2007-01-23),
14. 6750551 - Direct BGA attachment without solder reflow (2004-06-15),
15. 6239973 - EMI containment for microprocessor core mounted on a card using surface mounted clips (2001-05-29),

Title: Innovations of Charles A Gealer

Introduction

Charles A Gealer is a prominent inventor based in Phoenix, AZ, known for his significant contributions to the field of integrated circuit technology. With a total of 17 patents to his name, Gealer has made a substantial impact on the development of advanced electronic systems.

Latest Patents

Gealer's latest patents include innovative designs such as stacked-chip packages in package-on-package apparatus and methods of assembling these systems. One of his notable inventions is a stacked-chip apparatus that features a package substrate and an interposer with a chip stack, designed with a standoff that matches the interposer. Additionally, he has developed a mainboard assembly that includes a package overlying a die directly attached to the mainboard, which enhances the efficiency of integrated circuit assemblies.

Career Highlights

Gealer has built a successful career at Intel Corporation, where he has been instrumental in advancing the company's technological capabilities. His work focuses on improving the integration and performance of electronic components, which has led to more efficient and compact designs in the industry.

Collaborations

Throughout his career, Gealer has collaborated with talented professionals such as Johanna M Swan and Qing Ma. These partnerships have fostered innovation and have contributed to the successful development of various projects within the company.

Conclusion

Charles A Gealer's contributions to the field of integrated circuits and his innovative patents have established him as a key figure in the technology sector. His work continues to influence the design and functionality of electronic systems today.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…