The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2016
Filed:
Sep. 28, 2012
Qing MA, Saratoga, CA (US);
Johanna M. Swan, Scottsdale, AZ (US);
Min Tao, Tempe, AZ (US);
Charles A. Gealer, Phoenix, AZ (US);
Edward A. Zarbock, Gilbert, AZ (US);
Qing Ma, Saratoga, CA (US);
Johanna M. Swan, Scottsdale, AZ (US);
Min Tao, Tempe, AZ (US);
Charles A. Gealer, Phoenix, AZ (US);
Edward A. Zarbock, Gilbert, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Integration of sensor chips with integrated circuit (IC) chips. At least a first sensor chip including a first sensor is affixed to a first side of an interposer to hermitically seal the first sensor within a first cavity. An IC chip is affixed to a second side of the interposer opposite the first sensor, the IC chip is electrically coupled to the first sensor by a through via in the interposer. In embodiments, the first sensor includes a MEMS device and the IC chip comprises a circuit to amplify a signal from the MEMS device. The interposer may be made of glass, with the first sensor chip and the IC chip flip-chip bonded to the interposer by compression or solder. Lateral interconnect traces provide I/O between the devices on the interposer and/or a PCB upon which the interpose is affixed.