The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2019
Filed:
Sep. 08, 2008
Damion Searls, Hillsboro, OR (US);
Weston C. Roth, Portland, OR (US);
Margaret D. Ramirez, Forest Grove, OR (US);
James D. Jackson, Beaverton, OR (US);
Rainer E. Thomas, Beaverton, OR (US);
Charles A. Gealer, Phoenix, AZ (US);
Damion Searls, Hillsboro, OR (US);
Weston C. Roth, Portland, OR (US);
Margaret D. Ramirez, Forest Grove, OR (US);
James D. Jackson, Beaverton, OR (US);
Rainer E. Thomas, Beaverton, OR (US);
Charles A. Gealer, Phoenix, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Disclosed are embodiments of a system-level assembly including an integrated circuit (IC) die directly attached to a mainboard. An IC die directly attached to a mainboard or other circuit board may be referred to as a direct-chip attach (DCA) die. A package is disposed over at least a portion of the DCA die and coupled with the mainboard. The package includes one or more other IC die disposed on a substrate. Other embodiments are described and claimed.