Portland, OR, United States of America

Damion T Searls

This inventor holds 47 USPTO granted patents and 2 published patent applications and 5 EPO patents, primarily in Thermal Management. Top assignees: Intel Corporation, Other. Active years: 2001-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Damion T Searls. Retrieved from https://idiyas.com/inventor/damion-t-searls

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 47 

% Patents Active = 63.8


Average Co-Inventor Count = 3.2

ph-index = 12

Forward Citations = 418(Granted Patents)


Location History:

  • Hillsboro, OR (US) (2003 - 2019)
  • Portland, OR (US) (2001 - 2020)

Company Filing History:


Years Active: 2001-2025

Loading Chart...
Loading Chart...
Areas of Expertise:
Liquid Cooling
Leak Detection
Loadline Impedance
Passive Phase Change
Flexible Display
Thin Semiconductor Package
AC Coupling
Heat Dissipation
Integrated Circuit
Thermal Interface Material
Ganged Land Grid Array
Surface Mount Technology
47 patents (USPTO):Explore Patents

Title: **Innovative Contributions of Damion T. Searls in Integrated Circuit Technology**

Introduction

Damion T. Searls, based in Portland, Oregon, is a prolific inventor with an impressive portfolio comprising 46 patents. His innovative contributions primarily focus on advanced electronic systems and integrated circuit technology, which play a critical role in the modernization of electronic devices.

Latest Patents

Among his latest patents, the most notable is the "Mainboard assembly including a package overlying a die directly attached to the mainboard." This patent discusses embodiments of a system-level assembly where an integrated circuit (IC) die is directly attached to a mainboard. This method, known as direct-chip attach (DCA), enhances the efficiency and effectiveness of electronic systems. In this innovative assembly, a package is strategically placed over the DCA die and coupled with the mainboard, which incorporates one or more additional IC die positioned on a substrate. This advancement promises improved performance and functionality in modern computing devices.

Career Highlights

Damion Searls has built his career by contributing significantly to the field of electronics, particularly while working at Intel Corporation. His work has been pivotal in shaping next-generation technologies that power a myriad of devices we rely on today.

Collaborations

Throughout his career, Damion has collaborated with talented professionals, including Terrance J. Dishongh and James Daniel Jackson. These collaborations have led to the development of groundbreaking technologies and patents, showcasing the importance of teamwork in driving innovation in the tech industry.

Conclusion

In conclusion, Damion T. Searls stands out as a noteworthy inventor in the realm of integrated circuit technology. With 46 patents to his name, his contributions have had a significant impact on the electronic landscape. His latest innovations, alongside valuable partnerships, underscore the ongoing evolution and advancement in technology, paving the way for future developments in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…