The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2025
Filed:
Dec. 23, 2020
Intel Corporation, Santa Clara, CA (US);
Prabhakar Subrahmanyam, San Jose, CA (US);
Yi Xia, Campbell, CA (US);
Ying-Feng Pang, San Jose, CA (US);
Victor Polyanko, Kent, WA (US);
Mark Bianco, Redwood City, CA (US);
Bijoyraj Sahu, Portland, OR (US);
Minh T. D. Le, North Plains, OR (US);
Carlos Alvizo Flores, Guadalajara, MX;
Javier Avalos Garcia, Zapopan, MX;
Adriana Lopez Iniguez, Jalisco, MX;
Luz Karine Sandoval Granados, Zapopan, MX;
Michael Berktold, Phoenix, AZ (US);
Damion Searls, Portland, OR (US);
Jin Yang, Hillsboro, OR (US);
David Shia, Portland, OR (US);
Samer Melhem, Tualatin, OR (US);
Jeffrey Ryan Conner, Beaverton, OR (US);
Hemant Desai, Gilbert, AZ (US);
John Raatz, Chandler, AZ (US);
Richard Dischler, Bolton, ME (US);
Bergen Anderson, Santa Clara, CA (US);
Eric W. Buddrius, Hillsboro, OR (US);
Kenan Arik, Hillsboro, OR (US);
Barrett M. Faneuf, Beaverton, OR (US);
Lianchang Du, Kunshan, CN;
Yuehong Fan, Shanghai, CN;
Shengzhen Zhang, Shanghai, CN;
Yuyang Xia, Shanghai, CN;
Jun Zhang, Shanghai, CN;
Yuan Li, Shanghai, CN;
Catharina Biber, Portland, OR (US);
Kristin L. Weldon, Hillsboro, OR (US);
Brendan T. Pavelek, Portland, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.