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For the Inventor, By the Inventor

Bolton, MA, United States of America

Richard J Dischler

This inventor holds 26 USPTO granted patents and 3 published patent applications and 1 EPO patent, primarily in Waveguide Technologies. Top assignees: Intel Corporation, Compaq Computer Corporation, Inc.. Active years: 2001-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Richard J Dischler. Retrieved from https://idiyas.com/inventor/richard-j-dischler

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 26 

% Patents Active = 92.3

 

Average Co-Inventor Count = 5.1

ph-index = 3

Forward Citations = 143(Granted Patents)


Company Filing History:

goldMedal25 out of 56,322 
 
Intel Corporation
 patents
silverMedal1 out of 2,019 
 
Compaq Computer Corporation, Inc.
 patents

Years Active: 2001-2025

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Areas of Expertise:
Liquid Cooling
Leak Detection
Millimeter Waveguides
Microelectronic Packages
Signal Pathways
Thermal Management
Interconnects
Computing Architectures
Wireless Interconnects
Dielectric Waveguides
Multi-Tile Processors
Frequency Division Multiplexing
26 patents (USPTO):Explore Patents
1. 12442712 - Liquid cooling system leak detection improvements (2025-10-14),
2. 12183961 - Methods for conductively coating millimeter waveguides (2024-12-31),
3. 12150271 - Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device (2024-11-19),
4. 11716826 - Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device (2023-08-01),
5. 11656662 - Layered super-reticle computing : architectures and methods (2023-05-23),
6. 11581272 - Contactless high-frequency interconnect (2023-02-14),
7. 11269805 - Signal pathways in multi-tile processors (2022-03-08),
8. 11153105 - Technologies for densely packaging network components for large scale indirect topologies (2021-10-19),
9. 11108433 - Single side band transmission over a waveguide (2021-08-31),
10. 11095012 - Methods for conductively coating millimeter waveguides (2021-08-17),
11. 11031666 - Waveguide comprising a dielectric waveguide core surrounded by a conductive layer, where the core includes multiple spaces void of dielectric (2021-06-08),
12. 11026351 - Computing apparatus with closed cooling loop (2021-06-01),
13. 11024933 - Waveguide comprising an extruded dielectric waveguide core that is coextruded with an outer conductive layer (2021-06-01),
14. 10963022 - Layered super-reticle computing : architectures and methods (2021-03-30),
15. 10950919 - System comprising first and second servers interconnected by a plurality of joined waveguide sections (2021-03-16),

Title: Richard J Dischler: Innovator in Waveguide Technology

Introduction

Richard J Dischler, based in Bolton, MA, is a prolific inventor with an impressive portfolio of 25 patents. His work predominantly focuses on advancements in waveguide technology, specifically within the realm of microelectronics. Dischler's innovations have played a significant role in the development of more efficient electronic devices, enhancing communication systems in computing environments.

Latest Patents

Among his latest contributions, Dischler has developed methods for conductively coating millimeter waveguides. This innovative technique involves the formation of an elongate waveguide core made from a dielectric material, coupled with a conductive sheet wrapped around the core's surface. This design significantly enhances the performance of waveguides.

Another notable patent relates to platforms containing microelectronic packages linked to a chassis via waveguides. This electronic device innovation includes two server blades, each equipped with microelectronic packages, enabling efficient communication between the blades through the waveguide. These advancements are crucial for optimizing the functionality of modern computing devices.

Career Highlights

Dischler has had a distinguished career, working with leading technology companies such as Intel Corporation and Compaq Computer Corporation, Inc. His experiences in these organizations have allowed him to apply his inventive talents to projects that push the boundaries of technology and efficiency.

Collaborations

Throughout his career, Richard has collaborated with several esteemed professionals in the industry. Notably, he has worked alongside Telesphor Kamgaing and Georgios C Dogiamis, further illustrating the dynamic and innovative environment in which he operates.

Conclusion

Richard J Dischler's contributions to the field of waveguide technology and microelectronic packaging are noteworthy. With a significant number of patents to his name, his work continues to influence the design and functionality of critical electronic devices. His collaborations and employment at prestigious companies reflect his commitment to innovation and excellence in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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