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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12150271 B1

PDFFull Text
Date of Patent:
Nov. 19, 2024

Filed:

Jun. 08, 2023

Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Telesphor Kamgaing, Chandler, AZ (US);

Johanna M. Swan, Scottsdale, AZ (US);

Georgios Dogiamis, Chandler, AZ (US);

Henning Braunisch, Phoenix, AZ (US);

Adel A. Elsherbini, Chandler, AZ (US);

Aleksandar Aleksov, Chandler, AZ (US);

Richard Dischler, Bolton, MA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Akona IP PC

Primary Examiner:

Benny T Lee

Int. Cl.
CPC ...
H05K 7/14 (2006.01); H01P 3/16 (2006.01); H01P 5/08 (2006.01); H01P 5/12 (2006.01); H05K 1/02 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 23/66 (2006.01); H01L 25/18 (2023.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 7/1489 (2013.01); H01P 3/16 (2013.01); H01P 5/087 (2013.01); H01P 5/12 (2013.01); H05K 1/0243 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 25/18 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6627 (2013.01); H01L 2224/16225 (2013.01); H05K 1/181 (2013.01); H05K 2201/10356 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10734 (2013.01);
Abstract

Embodiments may relate an electronic device that includes a first server blade and a second server blade coupled with a chassis. The first and second server blades may include respective microelectronic packages. The electronic device may further include a waveguide coupled to the first and second server blades such that their respective microelectronic packages are communicatively coupled by the waveguide. Other embodiments may be described or claimed.

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