Intel Corporation

Compaq Computer Corporation, Inc.

Richard J Dischler

Telesphor Kamgaing

Georgios C Dogiamis

Johanna M Swan

Adel A Elsherbini

Aleksandar Aleksov

Shawna M Liff

Sasha N Oster

Brandon M Rawlings

Henning Braunisch

Simon C Steely, Jr

William J Butera

Hyung-Jin Lee

Devdatta P Kulkarni

Benjamin Keen

David Bach

Christian Karl

Olivier Franza

Brian Leung

Je-Young Chang

Jeff C Morriss

Kemal Aygun

Jun Zhang

Zhiguo Qian

Mathew J Manusharow

Sanka Ganesan

Wilfred Gomes

Damion T Searls

Ram S Viswanath

Rajasekaran Swaminathan

David Shia

Michael A Parker

Sriram Srinivasan

Mario Flajslik

Barrett M Faneuf

Yidnekachew S Mekonnen

Jin Yang

Eric W Buddrius

Cho-Ying Lu

Bijoyraj Sahu

Kenan Huseyin Arik

Reinhard C Schumann

Eric R Borch

Prabhakar Subrahmanyam

Yu Amos Zhang

Eduard Roytman

Ajay Balankutty

Catharina Biber

Michael Berktold

Ying-Feng Pang

Kristin L Weldon

Yi Xia

Victor Polyanko

Carlos Alvizo Flores

Brendan T Pavelek

Javier Avalos Garcia

Lianchang Du

Said Rami

Minh T D Le

Yuyang Xia

Yuehong Fan

Luz Karine Sandoval Granados

Adriana Lopez Iniguez

Mark Bianco

Samer Melhem

Jeffrey Ryan Conner

John Raatz

Bergen Anderson

Shengzhen Zhang

Yuan Li

Hemant Desai

Victor J Prokoff

Jim Klumpp

Simon C Steely Jr

An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.

Liquid cooling system leak detection improvements

A method of forming a waveguide comprises forming an elongate waveguide core including a dielectric material; and arranging a conductive sheet around an outside surface of the dielectric core to produce a conductive layer around the waveguide core.

Methods for conductively coating millimeter waveguides

Embodiments may relate an electronic device that includes a first server blade and a second server blade coupled with a chassis. The first and second server blades may include respective microelectronic packages. The electronic device may further include a waveguide coupled to the first and second server blades such that their respective microelectronic packages are communicatively coupled by the waveguide. Other embodiments may be described or claimed.

Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device

Embodiments may relate an electronic device that includes a first platform and a second platform coupled with a chassis. The platforms may include respective microelectronic packages. The electronic device may further include a waveguide coupled to the first platform and the second platform such that their respective microelectronic packages are communicatively coupled by the waveguide. Other embodiments may be described or claimed.

Embodiments herein may present an integrated circuit or a computing system having an integrated circuit, where the integrated circuit includes a physical network layer, a physical computing layer, and a physical memory layer, each having a set of dies, and a die including multiple tiles. The physical network layer further includes one or more signal pathways dynamically configurable between multiple pre-defined interconnect topologies for the multiple tiles, where each topology of the multiple pre-defined interconnect topologies corresponds to a communication pattern related to a workload. At least a tile in the physical computing layer is further arranged to move data to another tile in the physical computing layer or a storage cell of the physical memory layer through the one or more signal pathways in the physical network layer. Other embodiments may be described and/or claimed.

Layered super-reticle computing : architectures and methods

Embodiments may relate to a multi-chip microelectronic package that includes a first die and a second die coupled to a package substrate. The first and second dies may have respective radiative elements that are communicatively coupled with one another such that they may communicate via an electromagnetic signal with a frequency at or above approximately 20 gigahertz (GHz). Other embodiments may be described or claimed.

Contactless high-frequency interconnect

Embodiments herein may present a multi-tile processor including a plurality of processor tiles, and a plurality of interconnects selectively coupling the plurality of processor tiles to each other. A first processor tile may include a memory to store a bulletin board to hold a message, an execution unit, and an encapsulated software module. The encapsulated software module may select a second processor tile coupled with the first processor tile by an interconnect to be a part of a signal pathway. The second processor tile may be selected based on a selection criterion of the signal pathway and the message held in the bulletin board. The encapsulated software module may post and read a message at the bulletin board stored in the memory, or read a message from a bulletin board stored in a memory of the second processor tile. Other embodiments may be described and/or claimed.

Signal pathways in multi-tile processors

Technologies for densely packaging network components for large scale indirect topologies include group of switches. The group of switches includes a stack of node switches that includes a first set of ports and a stack of global switches that includes a second set of ports. The stack of node switches are oriented orthogonally to the stack of global switches. Additionally, the first set of ports are oriented towards the second set of ports and the node switches are connected to the global switches through the first and second sets of ports. Other embodiments are also described and claimed.

Technologies for densely packaging network components for large scale indirect topologies

Embodiments herein may relate to an interconnect that includes a transceiver, wherein the transceiver is configured to generate a single side band (SSB) signal for communication over a waveguide and a waveguide interconnect to communicate the SSB signal over the waveguide. In an example, an SSB operator is configured to generate the SSB signal and the SSB signal can be generated by use of a finite-impulse response filter. Other embodiments may be described and/or claimed.

Single side band transmission over a waveguide

An apparatus comprises a waveguide including: an elongate waveguide core including a dielectric material, wherein the waveguide core includes at least one space arranged lengthwise along the waveguide core that is void of the dielectric material; and a conductive layer arranged around the waveguide core.

Waveguide comprising a dielectric waveguide core surrounded by a conductive layer, where the core includes multiple spaces void of dielectric

The present disclosure describes embodiments of apparatuses and methods related to a computing apparatus with a closed cooling loop thermally coupled to one or more processors disposed on a circuit board of the computing apparatus. The closed cooling loop circulates a dielectric fluid to absorb heat from the processor. A portion of the dielectric fluid is evaporated from the processor heat absorbed by the dielectric fluid. A heat exchanger is coupled to the circuit board and thermally coupled to the closed cooling loop. The heat exchanger is to include a coolant flow to remove heat from the dielectric fluid circulated through the portion of the closed cooling loop thermally coupled to the heat exchanger. A vapor portion of the dielectric fluid is condensed from the heat removed by the coolant flow. Other embodiments may be described and/or claimed.

Computing apparatus with closed cooling loop

A method of making a waveguide, comprises: extruding a first dielectric material as a waveguide core of the waveguide, wherein the waveguide core is elongate; and coextruding an outer layer with the waveguide core, wherein the outer layer is arranged around the waveguide core.

Waveguide comprising an extruded dielectric waveguide core that is coextruded with an outer conductive layer

An apparatus comprises a waveguide section including an outer layer of conductive material tubular in shape and having multiple ends; and a joining feature on at least one of the ends of the waveguide section configured for joining to a second separate waveguide section.

System comprising first and second servers interconnected by a plurality of joined waveguide sections

Growing community of inventors

Bolton, MA, United States of America

Richard J Dischler