Company Filing History:
Years Active: 2021-2025
Title: Innovations of Lianchang Du
Introduction
Lianchang Du is a notable inventor based in Kunshan, China. He has made significant contributions to the field of electronic systems, particularly in liquid cooling technologies. With a total of 3 patents to his name, Du continues to push the boundaries of innovation in his field.
Latest Patents
One of Lianchang Du's latest patents focuses on improvements in liquid cooling system leak detection. This apparatus includes a cover that encloses a junction between the ends of first and second fluidic conduits, which transport coolant fluid within an electronic system. The leak detection device is strategically located within the enclosed region to identify any leaks at the junction. Another apparatus described in his patents also includes a leak detection device aimed at detecting coolant fluid leaks from specific components or junctions in a liquid cooling system.
Additionally, Du has developed power management techniques for computing platforms operating in low-temperature environments. These techniques involve a preheating stage added to the power-up sequence, which ensures that target components reach an optimal operating temperature more quickly. This innovation allows for a faster boot process, enhancing the overall efficiency of electronic systems.
Career Highlights
Lianchang Du is currently employed at Intel Corporation, where he applies his expertise in electronic systems and cooling technologies. His work at Intel has positioned him as a key player in the development of advanced cooling solutions for high-performance computing.
Collaborations
Du collaborates with talented colleagues such as Jun Zhang and Yuyang Xia, contributing to a dynamic team focused on innovation and technological advancement.
Conclusion
Lianchang Du's contributions to liquid cooling technologies and power management techniques highlight his role as an influential inventor in the electronics field. His ongoing work at Intel Corporation continues to pave the way for future innovations in electronic systems.