The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2025
Filed:
Jun. 26, 2020
Intel Corporation, Santa Clara, CA (US);
Min Wu, Shanghai, CN;
Jun Zhang, Shanghai, CN;
Yuyang Xia, Shanghai, CN;
Dan Liu, Shanghai, CN;
Chao Zhou, Shanghai, CN;
Lianchang Du, Jiangsu, CN;
Carrie Chen, Taipei, TW;
Nishi Ahuja, Portland, OR (US);
Jason Crop, Fort Collins, CO (US);
Wenqing Lv, Shanghai, CN;
Intel Corporation, Santa Clara, CA (US);
Abstract
Disclosed embodiments are related to techniques for powering compute platforms in low temperature environments. Embodiments include a preheating stage that is added to a power up sequence. The preheating stage may include a force-on stage and a force-offstage. During the force-on stage, all power rails of target components are forced to an ON state so that the target components consume current. When a target operating temperature is reached, the power rails of the target components are turned off, which causes the target components to revert back to their initial (pre-boot) state allowing the normal boot process to take place. Since the target components are now heated up, the boot process can execute faster than when the target components were cold. Other embodiments may be described and/or claimed.