Intel Corporation

Lianchang Du

Jun Zhang

Yuyang Xia

Damion T Searls

David Shia

Richard J Dischler

Barrett M Faneuf

Jin Yang

Casey R Winkel

Eric W Buddrius

Nishi Ahuja

Bijoyraj Sahu

Kenan Huseyin Arik

Prabhakar Subrahmanyam

Catharina Biber

Shaorong Zhou

Ying-Feng Pang

Michael Berktold

Kristin L Weldon

Yi Xia

Victor Polyanko

Feng Qi

Carlos Alvizo Flores

Brendan T Pavelek

Javier Avalos Garcia

Minh T D Le

Mark Bianco

Min Wu

Jason Crop

Yuehong Fan

Luz Karine Sandoval Granados

Adriana Lopez Iniguez

Samer Melhem

Jeffrey Ryan Conner

John Raatz

Bergen Anderson

Shengzhen Zhang

Yuan Li

Hemant Desai

Carrie Chen

Dan Liu

Chao Zhou

Wenqing Lv

An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.

Liquid cooling system leak detection improvements

Disclosed embodiments are related to techniques for powering compute platforms in low temperature environments. Embodiments include a preheating stage that is added to a power up sequence. The preheating stage may include a force-on stage and a force-offstage. During the force-on stage, all power rails of target components are forced to an ON state so that the target components consume current. When a target operating temperature is reached, the power rails of the target components are turned off, which causes the target components to revert back to their initial (pre-boot) state allowing the normal boot process to take place. Since the target components are now heated up, the boot process can execute faster than when the target components were cold. Other embodiments may be described and/or claimed.

Power management techniques for computing platforms in low temperature environments

Technologies for managing hot spots in a compute device with use of a vortex tube are disclosed. Cold air from one or more vortex tubes can be routed to hot spots of one or more compute devices, providing effective spot cooling. This approach may allow for cooling of components that might otherwise be difficult to cool, such as components where would be difficult or impossible to cool with a heat sink. This approach may also be effective in cooling components that are downstream of a heat sink and would otherwise only be cooled by air that was already heated by the heat sink.

Technologies for managing hot spots in a compute device

Growing community of inventors

Kunshan, China

Lianchang Du