The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2009
Filed:
Apr. 12, 2006
James D. Jackson, Beaverton, OR (US);
Damion T. Searls, Hillsboro, OR (US);
Yoshihiro Tomita, Tsukuba, JP;
James D. Jackson, Beaverton, OR (US);
Damion T. Searls, Hillsboro, OR (US);
Yoshihiro Tomita, Tsukuba, JP;
Intel Corporation, Santa Clara, CA (US);
Abstract
A thin semiconductor device package, comprising a thin substrate, at least one thin die coupled with the substrate and having a perimeter dimension less than that of the substrate, a mold material provided at a surface of the substrate adjacent to the perimeter of the die so that a surface of the mold material is coplanar with a surface of the die, and at least one electrically conductive pathway having at least one first terminal end configured to provide electrical continuity with the conductive element and at least one second terminal end formed at a surface of the mold material, the pathway extending from the first terminal end to the second terminal end.