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For the Inventor, By the Inventor

Beaverton, OR, United States of America

James Daniel Jackson

USPTO Granted Patents = 20 

 

Average Co-Inventor Count = 3.3

ph-index = 7

Forward Citations = 154(Granted Patents)


Company Filing History:

goldMedal19 out of 54,688 
 
Intel Corporation
 patents
silverMedal1 out of 832,718 
Other
 patents

Years Active: 2003-2020

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20 patents (USPTO):Explore Patents
1. 10555417 - Mainboard assembly including a package overlying a die directly attached to the mainboard (2020-02-04),
2. 10251273 - Mainboard assembly including a package overlying a die directly attached to the mainboard (2019-04-02),
3. 7791585 - Method of fabricating flexible display (2010-09-07),
4. 7638884 - Thin semiconductor device package (2009-12-29),
5. 7517732 - Thin semiconductor device package (2009-04-14),
6. 7495318 - Apparatus and method for improving AC coupling on circuit boards (2009-02-24),
7. 7361988 - Apparatuses and methods to route line to line (2008-04-22),
8. 7255492 - Electro-optic surface mount light pipe and connector (2007-08-14),
9. 7158111 - Flexible display (2007-01-02),
10. 7135758 - Surface mount solder method and apparatus for decoupling capacitance and process of making (2006-11-14),
11. 6996899 - Electronic assembly and a method of constructing an electronic assembly (2006-02-14),
12. 6906921 - Channeled heat dissipation device and a method of fabrication (2005-06-14),
13. 6905979 - Apparatus and method for improving AC coupling on circuit boards (2005-06-14),
14. 6856016 - Method and apparatus using nanotubes for cooling and grounding die (2005-02-15),
15. 6747873 - Channeled heat dissipation device and a method of fabrication (2004-06-08),

Title: James Daniel Jackson: Innovator in Integrated Circuit Technology

Introduction

James Daniel Jackson, based in Beaverton, OR, is a prolific inventor holding 20 patents in the field of integrated circuit technology. His innovative contributions encompass advanced assembly techniques and designs that promote efficiency and efficacy in electronic systems.

Latest Patents

Among his recent patents, a notable invention is the mainboard assembly that features a package overlying a die directly attached to the mainboard. This groundbreaking design includes an integrated circuit (IC) die, termed a direct-chip attach (DCA) die, that is directly coupled to the mainboard. The assembly incorporates a package that covers a portion of the DCA die, which is coupled with the mainboard. Furthermore, this package can host additional IC dies placed on a substrate, showcasing Jackson's expertise in creating multifunctional electronic assemblies.

Career Highlights

James Daniel Jackson has made significant strides in his career, notably during his tenure at Intel Corporation. His work has consistently pushed the boundaries of current technology, leading to enhanced performance and capabilities in integrated circuits. Jackson's patents represent a blend of innovation and practical application, connecting theoretical concepts with real-world utility.

Collaborations

Throughout his career, Jackson has collaborated with notable colleagues, including Damion T. Searls and Terrance J. Dishongh. These partnerships have contributed to the development of cutting-edge technologies, fostering an environment of creativity and innovation that drives the tech industry forward.

Conclusion

James Daniel Jackson stands out as a key figure in the realm of integrated circuit innovations. With an impressive portfolio of patents and a successful career at prominent technology companies, his work continues to influence the design and functionality of modern electronic systems. His contributions not only showcase his ingenuity but also pave the way for future advancements in the field.

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