The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2006
Filed:
Mar. 25, 2003
Applicants:
Damion T. Searls, Hillsboro, OR (US);
Terrance J. Dishongh, Hillsboro, OR (US);
James D. Jackson, Beaverton, OR (US);
Inventors:
Damion T. Searls, Hillsboro, OR (US);
Terrance J. Dishongh, Hillsboro, OR (US);
James D. Jackson, Beaverton, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
Solder bumps are created on a substrate of an electronic assembly having lengths that are longer than the widths. The solder bumps are created by locating solder balls of power or ground connections close to one another so that, upon reflow, the solder balls combine. Signal solder balls however remain separated. Capacitors are created by locating power solder bumps adjacent ground solder bumps and extending parallel to one another.