The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2005
Filed:
Jul. 02, 2002
Damion T. Searls, Hillsboro, OR (US);
Terrance J. Dishongh, Hillsboro, OR (US);
James Daniel Jackson, Beaverton, OR (US);
Damion T. Searls, Hillsboro, OR (US);
Terrance J. Dishongh, Hillsboro, OR (US);
James Daniel Jackson, Beaverton, OR (US);
Other;
Abstract
An embodiment of the present invention described and shown in the specification and drawings is a process and a package for facilitating cooling and grounding of a semiconductor die using carbon nanotubes in a thermal interface layer between the die and a thermal management aid. The embodiments that are disclosed have the carbon nanotubes positioned and sized to utilize their high thermal and electrical conductance to facilitate the flow of heat and current to the thermal management aid. One embodiment disclosed has the carbon nanotubes mixed with a paste matrix before being applied. Another disclosed embodiment has the carbon nanotubes grown on the surface of the semiconductor die.