IDiyas

For the Inventor, By the Inventor

Tsukuba, Japan

Yoshihiro Tomita

USPTO Granted Patents = 46 

Average Co-Inventor Count = 4.5

ph-index = 6

Forward Citations = 120(Granted Patents)


Location History:

  • Ibaraka-Ken, JP (2013)
  • Ibaraki-Ken, JP (2011 - 2015)
  • Ibaraki, JP (2010 - 2022)
  • Tsukuba, JP (2009 - 2024)

Company Filing History:

goldMedal46 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2009-2025

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46 patents (USPTO):
1. 12438087 - High throughput additive manufacturing for integrated circuit components containing traces with feature size and grain boundaries (2025-10-07),
2. 12431430 - Technologies for high throughput additive manufacturing for integrated circuit components (2025-09-30),
3. 12183596 - Low cost package warpage solution (2024-12-31),
4. 11955434 - Ultra small molded module integrated with die by module-on-wafer assembly (2024-04-09),
5. 11764080 - Low cost package warpage solution (2023-09-19),
6. 11387200 - Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric (2022-07-12),
7. 11335651 - Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric (2022-05-17),
8. 11328937 - Low cost package warpage solution (2022-05-10),
9. 11075166 - Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate (2021-07-27),
10. 10790231 - Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate (2020-09-29),
11. 10741419 - Low cost package warpage solution (2020-08-11),
12. 10636716 - Through-mold structures (2020-04-28),
13. 10629551 - Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric (2020-04-21),
14. 10573608 - Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package (2020-02-25),
15. 10418329 - Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate (2019-09-17),

Title: Innovations by Yoshihiro Tomita: Pioneering Solutions in Device Packaging

Introduction

Yoshihiro Tomita is a notable inventor hailing from Tsukuba, Japan, recognized for his contributions to the field of device packaging. With an impressive portfolio of 44 patents, Tomita has made significant strides in developing technologies that enhance the functionality and efficiency of electronic devices.

Latest Patents

Among his latest inventions are two remarkable patents. The first is focused on a low-cost package warpage solution. This innovation encompasses device packages and methods for their formation. It involves creating a reinforcement layer over a substrate, where device dies can be secured through openings for reliable bonding via solder bumps. The versatility of the invention is highlighted by alternative embodiments that feature adhesive-backed reinforcement layers.

The second patent details an ultra-small molded module integrated with a die through module-on-wafer assembly. This technology allows for the integration of molded modules into electrical packages. It includes a die equipped with a redistribution layer on its surface, enabling effective electrical connection between terminals of encapsulated components and the redistribution layer. Furthermore, this invention may also incorporate through-mold vias and Faraday cages to enhance functionality.

Career Highlights

Yoshihiro Tomita is currently associated with Intel Corporation, a leading technology company renowned for its innovative semiconductor products. His work has not only advanced the knowledge within the industry but has also contributed to practical applications affecting numerous electronic devices today.

Collaborations

Throughout his career, Tomita has collaborated with esteemed colleagues, including Shawna M. Liff and Omkar G. Karhade. These partnerships have fostered an environment of creativity and innovation, further propelling advancements in the field of electronics.

Conclusion

Yoshihiro Tomita's work and innovations significantly impact the world of device packaging, setting new standards for the industry. His latest patents demonstrate a commitment to enhancing technology and providing solutions that address real-world challenges in electronic device design. As he continues his journey at Intel Corporation, the ongoing contributions of this inventive mind are sure to pave the way for future advancements.

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