The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Dec. 22, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Georgios C. Dogiamis, Chandler, AZ (US);

Telesphor Kamgaing, Chandler, AZ (US);

Eric J. Li, Chandler, AZ (US);

Javier A. Falcon, Chandler, AZ (US);

Yoshihiro Tomita, Ibaraki, JP;

Vijay K. Nair, Mesa, AZ (US);

Shawna M. Liff, Scottsdale, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/3107 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/552 (2013.01); H01L 25/16 (2013.01); H01L 2223/6677 (2013.01);
Abstract

Embodiments of the invention include a microelectronic device that includes a first die having a silicon based substrate and a second die coupled to the first die. In one example, the second die is formed with compound semiconductor materials. The microelectronic device includes a substrate that is coupled to the first die with a plurality of electrical connections. The substrate including an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.


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