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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Eric Jin Li

USPTO Granted Patents = 51 

Average Co-Inventor Count = 3.5

ph-index = 7

Forward Citations = 180(Granted Patents)

Forward Citations (Not Self Cited) = 177(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:

goldMedal51 out of 54,750 
 
Intel Corporation
 patents

Years Active: 2006-2024

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Areas of Expertise:
Microelectronic Structures
Wafer-Level Packaging
Electromagnetic Interference Shielding
Thermal Performance
Die Warpage Control
High Frequency Communication Devices
Printed Circuit Boards
Chemical Vapor Deposition
Laser Micromachining
Solder Paste Transfer
Thin Wafer Processing
Nanopowder Coating
51 patents (USPTO):Explore Patents
1. 11955434 - Ultra small molded module integrated with die by module-on-wafer assembly (2024-04-09),
2. 11903138 - Fine feature formation techniques for printed circuit boards (2024-02-13),
3. 11705377 - Stacked die cavity package (2023-07-18),
4. 11676900 - Electronic assembly that includes a bridge (2023-06-13),
5. 11545441 - Semiconductor package having wafer-level active die and external die mount (2023-01-03),
6. 11328968 - Stacked die cavity package (2022-05-10),
7. 11114388 - Warpage control for microelectronics packages (2021-09-07),
8. 11089689 - Fine feature formation techniques for printed circuit boards (2021-08-10),
9. 11075166 - Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate (2021-07-27),
10. 10910317 - Semiconductor package having wafer-level active die and external die mount (2021-02-02),
11. 10790231 - Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate (2020-09-29),
12. 10707171 - Ultra small molded module integrated with die by module-on-wafer assembly (2020-07-07),
13. 10672626 - Method and materials for warpage thermal and interconnect solutions (2020-06-02),
14. 10615128 - Systems and methods for electromagnetic interference shielding (2020-04-07),
15. 10573608 - Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package (2020-02-25),

Title: The Innovative Journey of Eric Jin Li

Introduction: Eric Jin Li, a visionary inventor based in Chandler, AZ, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Eric Jin Li holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing his commitment to creating a more efficient and eco-friendly future.

Career Highlights: With a background in engineering and a passion for problem-solving, Eric Jin Li has led successful projects that have revolutionized industries such as healthcare, transportation, and telecommunications. His ability to think outside the box and his dedication to research and development have earned him a reputation as a trailblazer in the world of innovation.

Collaborations: Throughout his career, Eric Jin Li has collaborated with leading research institutions, universities, and tech companies to bring his ideas to life. His ability to work effectively in multidisciplinary teams has resulted in the successful implementation of cutting-edge technologies that have had a lasting impact on society.

Conclusion: Eric Jin Li's relentless pursuit of innovation and his unwavering commitment to creating a better world through technology make him a true pioneer in the field of invention. His work continues to inspire the next generation of inventors and serves as a testament to the power of creativity and perseverance in driving positive change.

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