Eric Jin Li

This inventor holds 52 USPTO granted patents and 9 published patent applications, primarily in Microelectronics Packaging (CPC class H01L). Top assignee: Intel Corporation. Active years: 2006-2026.

USPTO Granted Patents = 52 (Patent Applications = 9)

% Patents Active = 67.3

Average Co-Inventor Count = 3.5

ph-index = 7

Forward Citations = 182(Granted Patents)

Forward Citations (Not Self Cited) = 177(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

52 out of 56,184

Intel Corporation

patents

Years Active: 2006-2026

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Areas of Expertise:

Microelectronic Structures

Warpage Control

EMI Shielding

Stacked Die Package

Wafer-Level Packaging

Thermal Performance

High Density Interconnections

Ball Grid Array

Printed Circuit Boards

Thin Wafer Processing

Electronic Assembly

Compound Semiconductor Devices

52 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12525544 - Ultra small molded module integrated with die by module-on-wafer assembly (2026-01-13),

2. 11955434 - Ultra small molded module integrated with die by module-on-wafer assembly (2024-04-09),

3. 11903138 - Fine feature formation techniques for printed circuit boards (2024-02-13),

4. 11705377 - Stacked die cavity package (2023-07-18),

5. 11676900 - Electronic assembly that includes a bridge (2023-06-13),

6. 11545441 - Semiconductor package having wafer-level active die and external die mount (2023-01-03),

7. 11328968 - Stacked die cavity package (2022-05-10),

8. 11114388 - Warpage control for microelectronics packages (2021-09-07),

9. 11089689 - Fine feature formation techniques for printed circuit boards (2021-08-10),

10. 11075166 - Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate (2021-07-27),

11. 10910317 - Semiconductor package having wafer-level active die and external die mount (2021-02-02),

12. 10790231 - Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate (2020-09-29),

13. 10707171 - Ultra small molded module integrated with die by module-on-wafer assembly (2020-07-07),

14. 10672626 - Method and materials for warpage thermal and interconnect solutions (2020-06-02),

15. 10615128 - Systems and methods for electromagnetic interference shielding (2020-04-07),

Title: The Innovative Journey of Eric Jin Li

Introduction: Eric Jin Li, a visionary inventor based in Chandler, AZ, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Eric Jin Li holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing his commitment to creating a more efficient and eco-friendly future.

Career Highlights: With a background in engineering and a passion for problem-solving, Eric Jin Li has led successful projects that have revolutionized industries such as healthcare, transportation, and telecommunications. His ability to think outside the box and his dedication to research and development have earned him a reputation as a trailblazer in the world of innovation.

Collaborations: Throughout his career, Eric Jin Li has collaborated with leading research institutions, universities, and tech companies to bring his ideas to life. His ability to work effectively in multidisciplinary teams has resulted in the successful implementation of cutting-edge technologies that have had a lasting impact on society.

Conclusion: Eric Jin Li's relentless pursuit of innovation and his unwavering commitment to creating a better world through technology make him a true pioneer in the field of invention. His work continues to inspire the next generation of inventors and serves as a testament to the power of creativity and perseverance in driving positive change.