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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11676900 B1

PDFFull Text
Date of Patent:
Jun. 13, 2023

Filed:

Dec. 22, 2015

Electronic assembly that includes a bridge

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Eric J. Li, Chandler, AZ (US);

Nitin Deshpande, Chandler, AZ (US);

Shawna M. Liff, Scottsdale, AZ (US);

Omkar Karhade, Chandler, AZ (US);

Amram Eitan, Scottsdale, AZ (US);

Timothy A. Gosselin, Phoenix, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Schwabe, Williamson & Wyatt, P.C.

Primary Examiner:

Samuel Park

Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 23/538 (2006.01); H01L 23/48 (2006.01); H01L 25/065 (2023.01); H01L 23/36 (2006.01); H01L 23/13 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5381 (2013.01); H01L 21/4853 (2013.01); H01L 21/4871 (2013.01); H01L 23/13 (2013.01); H01L 23/36 (2013.01); H01L 23/48 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 23/367 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/92 (2013.01); H01L 2224/0612 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/15159 (2013.01);
Abstract

An electronic assembly that includes a substrate having an upper surface and a bridge that includes an upper surface. The bridge is within a cavity in the upper surface of the substrate. A first electronic component is attached to the upper surface of the bridge and the upper surface of the substrate and a second electronic component is attached to the upper surface of the bridge and the upper surface of the substrate, wherein the bridge electrically connects the first electronic component to the second electronic component.

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