Scottsdale, AZ, United States of America

Amram Eitan

This inventor holds 17 USPTO granted patents and 6 published patent applications and 1 EPO patent. Top assignee: Intel Corporation. Active years: 2008-2025.

USPTO Granted Patents = 17 (Patent Applications = 6)

% Patents Active = 47.1

EPO Patents = 1 (Patent Applications = 3)

Average Co-Inventor Count = 4.9

ph-index = 4

Forward Citations = 40(Granted Patents)

Company Filing History:

17 out of 56,184

Intel Corporation

patents

Years Active: 2008-2025

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17 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12417958 - Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone (2025-09-16),

2. 12347743 - Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone (2025-07-01),

3. 12341117 - Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates (2025-06-24),

4. 12315777 - Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone (2025-05-27),

5. 11676900 - Electronic assembly that includes a bridge (2023-06-13),

6. 11075166 - Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate (2021-07-27),

7. 10790231 - Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate (2020-09-29),

8. 10475715 - Two material high K thermal encapsulant system (2019-11-12),

9. 10418329 - Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate (2019-09-17),

10. 9786517 - Ablation method and recipe for wafer level underfill material patterning and removal (2017-10-10),

11. 9748199 - Thermal compression bonding process cooling manifold (2017-08-29),

12. 9653411 - Electronic package that includes fine powder coating (2017-05-16),

13. 9282650 - Thermal compression bonding process cooling manifold (2016-03-08),

14. 7851342 - In-situ formation of conductive filling material in through-silicon via (2010-12-14),

15. 7727814 - Microelectronic package interconnect and method of fabrication thereof (2010-06-01),

Title: The Innovative Journey of Amram Eitan

Introduction: Amram Eitan is a renowned inventor based in Scottsdale, Arizona, known for his groundbreaking contributions to various fields.

Latest Patents: Amram Eitan holds several patents in the areas of technology, healthcare, and sustainable energy, showcasing his diverse range of expertise.

Career Highlights: With a career spanning over two decades, Amram Eitan has been at the forefront of innovation, leading teams to develop cutting-edge solutions that have revolutionized industries.

Collaborations: Throughout his career, Amram Eitan has collaborated with top research institutions, universities, and leading companies to bring his inventions to life, fostering a culture of creativity and excellence.

Conclusion: Amram Eitan's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.