The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2017
Filed:
Sep. 09, 2013
Rajendra C. Dias, Phoenix, AZ (US);
Lars D. Skoglund, Chandler, AZ (US);
Anil R. Indluru, Tempe, AZ (US);
Edward R. Prack, Phoenix, AZ (US);
Danish Faruqui, Chandler, AZ (US);
Tyler N. Osborn, Gilbert, AZ (US);
Amram Eitan, Scottsdale, AZ (US);
Timothy A. Gosselin, Phoenix, AZ (US);
Rajendra C. Dias, Phoenix, AZ (US);
Lars D. Skoglund, Chandler, AZ (US);
Anil R. Indluru, Tempe, AZ (US);
Edward R. Prack, Phoenix, AZ (US);
Danish Faruqui, Chandler, AZ (US);
Tyler N. Osborn, Gilbert, AZ (US);
Amram Eitan, Scottsdale, AZ (US);
Timothy A. Gosselin, Phoenix, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Introducing an underfill material over contact pads on a surface of an integrated circuit substrate; and ablating the introduced underfill material to expose an area of the contact pads using temporally coherent electromagnetic radiation. A method including first ablating an underfill material to expose an area of contact pads on a substrate using temporally coherent electromagnetic radiation; introducing a solder to the exposed area of the contact pads; and second ablating the underfill material using temporally coherent electromagnetic radiation. A method including introducing an underfill material over contact pads on a surface of an integrated circuit substrate; defining an opening in the underfill material to expose an area of the contact pads using temporally coherent electromagnetic radiation; introducing a solder material to the exposed area of the contact pads; and after introducing the solder, removing the sacrificial material.