Phoenix, AZ, United States of America

Rajendra C Dias

This inventor holds 27 USPTO granted patents and 9 published patent applications, primarily in Semiconductor Packaging. Top assignees: Intel Corporation, Tahoe Research, Ltd.. Active years: 2007-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Rajendra C Dias. Retrieved from https://idiyas.com/inventor/rajendra-c-dias

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 27 

% Patents Active = 59.3

Average Co-Inventor Count = 4.2

ph-index = 3

Forward Citations = 44(Granted Patents)


Company Filing History:


Years Active: 2007-2023

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Areas of Expertise:
Semiconductor Package
EMI Shielding
Flexible Electronics
Underfill Material
Electronic Devices
Mechanical Testing
Stretchable Electronics
Gradient Encapsulant
Wire Bonds
Microelectronic Die
Thermal Management
Interconnection Structures
27 patents (USPTO):Explore Patents

Title: Rajendra C. Dias: Innovator in Semiconductor Technology

Introduction

Rajendra C. Dias is a prominent inventor based in Phoenix, AZ. He holds a significant portfolio of 27 patents, showcasing his influential contributions to the semiconductor industry. His innovative work focuses on improving the performance and reliability of semiconductor packages, which are essential components in modern electronic devices.

Latest Patents

Among his latest patents, Rajendra has developed a novel approach for underfill material flow control in semiconductor packages. This patent details a semiconductor apparatus that includes first and second semiconductor dies separated by a specific spacing. A barrier structure is placed strategically between the first semiconductor die and the common package substrate, ensuring efficient flow of underfill material while optimally protecting the semiconductor components.

Another notable patent involves methods and devices for electromagnetic interference (EMI) shielding. This innovation includes a substrate with integrated electrical connection circuitry and ground circuitry, enhancing the overall reliability of electronic devices by mitigating interference that could disrupt their performance.

Career Highlights

Rajendra's career includes significant tenures at renowned companies, including Intel Corporation and Tahoe Research, Ltd. His expertise and inventive spirit have driven advancements in semiconductor technologies, reaffirming his role as a leading figure in the field.

Collaborations

Throughout his career, Rajendra has collaborated with talented professionals like Joshua Heppner and Manish Dubey. These collaborations have facilitated the exchange of ideas and techniques, further refining his innovative contributions to semiconductor technology.

Conclusion

Rajendra C. Dias stands out as a visionary inventor in semiconductor technology. His impressive array of patents and his contributions to reputable companies underscore his commitment to innovation. As technology continues to advance, Rajendra's work will undoubtedly influence the future of electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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