The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

Jan. 24, 2019
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Rajendra C. Dias, Phoenix, AZ (US);

Mitul B. Modi, Phoenix, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 21/285 (2006.01); H01L 23/31 (2006.01); H01L 21/78 (2006.01); H01L 23/544 (2006.01); H01L 23/29 (2006.01); H01L 21/683 (2006.01); H01L 21/784 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/2855 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 21/784 (2013.01); H01L 23/295 (2013.01); H01L 23/3114 (2013.01); H01L 23/3121 (2013.01); H01L 23/544 (2013.01); H01L 24/17 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 24/94 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/83 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2223/5446 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73153 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73257 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/92227 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/10155 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/3511 (2013.01);
Abstract

Discussed generally herein are methods and devices including or providing an electromagnetic interference (EMI) shielding. A device can include substrate including electrical connection circuitry therein, ground circuitry on, or at least partially in the substrate, the ground circuitry at least partially exposed by a surface of the substrate, a die electrically connected to the connection circuitry and the ground circuitry, the die on the substrate, a conductive material on a die backside, and a conductive paste or one or more wires electrically connected to the ground circuitry and the conductive material.


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