The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Dec. 24, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Rajendra Dias, Phoenix, AZ (US);

Takashi Kumamoto, Tsukuba, JP;

Yoshishiro Tomita, Tsukuba, JP;

Mitul Modi, Phoenix, AZ (US);

Joshua Heppner, Chandler, AZ (US);

Eric Li, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/565 (2013.01); H01L 23/3135 (2013.01); H01L 21/561 (2013.01); H01L 23/3121 (2013.01); H01L 25/16 (2013.01); H01L 2224/73204 (2013.01);
Abstract

Electromagnetically shielded electronic device technology is disclosed. In an example, a method of making an electronic device package can comprise providing a substrate having a conductor pad and an electronic component. The method can also comprise forming a conformal insulating layer on the substrate and electronic component. The conformal insulating layer conforms to the electronic component. The method can further comprise exposing the conductor pad. In addition, the method can comprise forming an electrically conductive electromagnetic interference (EMI) layer on the insulating layer and in contact with the conductor pad.


Find Patent Forward Citations

Loading…