The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2018
Filed:
May. 26, 2017
Intel Corporation, Santa Clara, CA (US);
Anna M. Prakash, Chandler, AZ (US);
Reynaldo Alberto Olmedo, Phoenix, AZ (US);
Venmathy McMahan, Phoenix, AZ (US);
Rajendra C. Dias, Phoenix, AZ (US);
Joshua David Heppner, Chandler, AZ (US);
Ann Jinyan Xu, Chandler, AZ (US);
Sriya Sanyal, Chandler, AZ (US);
Eric Jin Li, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Semiconductor packages and methods of forming semiconductor packages are described. In an example, a semiconductor package includes a shielding layer containing metal particles, e.g., conductive particles or magnetic particles, in a resin matrix to attenuate electromagnetic interference. In an example, the shielding layer is transferred from a molding chase to the semiconductor package during a polymer molding operation.