Phoenix, AZ, United States of America

Venmathy McMahan

USPTO Granted Patents = 3 

 

Average Co-Inventor Count = 8.3

ph-index = 2

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2017-2019

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3 patents (USPTO):Explore Patents

Title: Venmathy McMahan: Innovator in Semiconductor Technology

Introduction

Venmathy McMahan is a prominent inventor based in Phoenix, AZ. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing electronic packaging and improving electromagnetic interference shielding.

Latest Patents

One of McMahan's latest patents is for a "Two material high K thermal encapsulant system." This invention relates to an electronic package that includes a first die and a second die stacked onto the first die. A first encapsulant is positioned between the two dies, made from a material that covers a specific volume. The first material has a higher thermal conductivity than the second material, which promotes better electrical connections between the dies.

Another notable patent is for a "Semiconductor package having an EMI shielding layer." This patent describes semiconductor packages and methods for forming them. The semiconductor package includes a shielding layer containing metal particles within a resin matrix to attenuate electromagnetic interference. This shielding layer is transferred from a molding chase to the semiconductor package during a polymer molding operation.

Career Highlights

Venmathy McMahan is currently employed at Intel Corporation, a leading company in semiconductor manufacturing. His innovative work has contributed to advancements in electronic packaging and semiconductor technology.

Collaborations

Throughout his career, McMahan has collaborated with talented individuals such as Anna M Prakash and Reynaldo Alberto Olmedo. These collaborations have further enhanced the quality and impact of his inventions.

Conclusion

Venmathy McMahan is a distinguished inventor whose work in semiconductor technology has led to multiple patents and significant advancements in the field. His contributions continue to shape the future of electronic packaging and electromagnetic interference solutions.

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