The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2020

Filed:

Mar. 06, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Aleksandar Aleksov, Chandler, AZ (US);

Mauro Kobrinsky, Portland, OR (US);

Johanna Swan, Scottsdale, AZ (US);

Rajendra C. Dias, Phoenix, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H05K 1/14 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 24/78 (2013.01); H01L 24/85 (2013.01); H05K 1/0284 (2013.01); H05K 1/0393 (2013.01); H05K 1/117 (2013.01); H05K 1/142 (2013.01); H05K 1/148 (2013.01); H05K 3/4691 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/4809 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/85399 (2013.01); H01L 2924/00014 (2013.01); H05K 2201/10287 (2013.01); Y10T 29/49126 (2015.01);
Abstract

Generally discussed herein are systems and apparatuses that can include apparatuses, systems, or method for a flexible, wire bonded device. According to an example an apparatus can include (1) a first rigid circuit comprising a first plurality of bond pads proximate to a first edge of the first rigid circuit, (2) a second rigid circuit comprising a second plurality of bond pads proximate to a first edge of the second rigid circuit, the second rigid circuit adjacent the first rigid circuit and the first edge of the second rigid circuit facing the first edge of the first rigid circuit, or (3) a first plurality of wire bonded wires, each wire bonded wire of the first plurality of wire bonded wires electrically and mechanically connected to a bond pad of the first plurality of bond pads and a bond pad of the second plurality of bond pads.


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