This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Intel Corporation. Active years: 2017.
Company Filing History:
Years Active: 2017
Title: Anil R Indluru: Innovator in Wafer Level Underfill Material Technology
Introduction
Anil R Indluru is a notable inventor based in Tempe, AZ (US). He has made significant contributions to the field of integrated circuit technology, particularly in the area of wafer level underfill material patterning and removal. His innovative approach has led to advancements that enhance the performance and reliability of electronic devices.
Latest Patents
Anil R Indluru holds a patent for an "Ablation method and recipe for wafer level underfill material patterning and removal." This patent describes a method that involves introducing an underfill material over contact pads on an integrated circuit substrate. The process includes ablating the underfill material to expose areas of the contact pads using temporally coherent electromagnetic radiation. The method further details the introduction of solder to the exposed areas and subsequent ablating of the underfill material.
Career Highlights
Anil R Indluru is currently employed at Intel Corporation, where he continues to work on innovative technologies that push the boundaries of electronic manufacturing. His expertise in the field has positioned him as a valuable asset to the company and the industry at large.
Collaborations
Anil has collaborated with esteemed colleagues such as Rajendra C Dias and Lars D Skoglund. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Anil R Indluru's contributions to the field of integrated circuit technology through his innovative patent demonstrate his commitment to advancing electronic manufacturing processes. His work continues to influence the industry and pave the way for future innovations.