Intel Corporation

Anil R Indluru

Edward Rudolph Prack

Rajendra C Dias

Amram Eitan

Tyler N Osborn

Timothy A Gosselin

Lars D Skoglund

Danish Faruqui

Introducing an underfill material over contact pads on a surface of an integrated circuit substrate; and ablating the introduced underfill material to expose an area of the contact pads using temporally coherent electromagnetic radiation. A method including first ablating an underfill material to expose an area of contact pads on a substrate using temporally coherent electromagnetic radiation; introducing a solder to the exposed area of the contact pads; and second ablating the underfill material using temporally coherent electromagnetic radiation. A method including introducing an underfill material over contact pads on a surface of an integrated circuit substrate; defining an opening in the underfill material to expose an area of the contact pads using temporally coherent electromagnetic radiation; introducing a solder material to the exposed area of the contact pads; and after introducing the solder, removing the sacrificial material.

Ablation method and recipe for wafer level underfill material patterning and removal

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Tempe, AZ, United States of America

Anil R Indluru