logo

For the Inventor, By the Inventor

Phoenix, AZ, United States of America

Timothy A Gosselin

This inventor holds 8 USPTO granted patents and 10 published patent applications. Top assignee: Intel Corporation. Active years: 2017-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Timothy A Gosselin. Retrieved from https://idiyas.com/inventor/timothy-a-gosselin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 8 

% Patents Active = 87.5

Average Co-Inventor Count = 4.7

ph-index = 3

Forward Citations = 15(Granted Patents)


Company Filing History:

goldMedal8 out of 56,322 
 
Intel Corporation
 patents

Years Active: 2017-2026

Loading Chart...
8 patents (USPTO):Explore Patents
1. 12604522 - Universal electrically inactive devices for integrated circuit packages (2026-04-14),
2. 12557675 - Inorganic redistribution layer on organic substrate in integrated circuit packages (2026-02-17),
3. 11676900 - Electronic assembly that includes a bridge (2023-06-13),
4. 11075166 - Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate (2021-07-27),
5. 10845552 - Coreless package architecture for multi-chip opto-electronics (2020-11-24),
6. 10790231 - Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate (2020-09-29),
7. 10418329 - Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate (2019-09-17),
8. 9786517 - Ablation method and recipe for wafer level underfill material patterning and removal (2017-10-10),

Title: Innovations of Timothy A. Gosselin

Introduction

Timothy A. Gosselin is a notable inventor based in Phoenix, AZ, who has made significant contributions to the field of electronics. With a total of 8 patents to his name, Gosselin's work focuses on advanced electronic assemblies and microelectronic structures.

Latest Patents

One of Gosselin's latest patents is an electronic assembly that includes a bridge. This innovative assembly features a substrate with an upper surface and a bridge that is situated within a cavity in the substrate. The design allows for a first electronic component to be attached to both the bridge and the substrate, while a second electronic component is similarly connected, enabling electrical connectivity between the two components through the bridge. Another significant patent involves microelectronic structures that incorporate multiple microelectronic devices connected by a microelectronic bridge embedded within a microelectronic substrate. This structure includes a cavity extending into the substrate, where the microelectronic bridge connects the first and second microelectronic devices, enhancing the functionality and efficiency of electronic systems.

Career Highlights

Gosselin is currently employed at Intel Corporation, a leading technology company known for its innovations in semiconductor manufacturing and computing technology. His work at Intel has allowed him to push the boundaries of electronic design and contribute to cutting-edge technology.

Collaborations

Throughout his career, Gosselin has collaborated with talented individuals such as Shawna M. Liff and Amram Eitan. These collaborations have fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies.

Conclusion

Timothy A. Gosselin's contributions to the field of electronics through his patents and work at Intel Corporation highlight his role as a significant inventor. His innovative designs continue to influence the advancement of electronic technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…