The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2016
Filed:
Dec. 18, 2013
Intel Corporation, Santa Clara, CA (US);
Hemanth Dhavaleswarapu, Chandler, AZ (US);
Zhihua Li, Chandler, AZ (US);
Joseph Petrini, Gilbert, AZ (US);
Steven B. Roach, Chandler, AZ (US);
Shankar Devasenathipathy, Tempe, AZ (US);
George Kostiew, Scottsdale, AZ (US);
Amram Eitan, Scottsdale, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.