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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Hemanth K Dhavaleswarapu

This inventor holds 11 USPTO granted patents and 2 published patent applications. Top assignee: Intel Corporation. Active years: 2016-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hemanth K Dhavaleswarapu. Retrieved from https://idiyas.com/inventor/hemanth-k-dhavaleswarapu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 11 

% Patents Active = 54.5

Average Co-Inventor Count = 4.6

ph-index = 2

Forward Citations = 23(Granted Patents)


Location History:

  • Phoenix, AZ (US) (2017 - 2020)
  • Chandler, AZ (US) (2016 - 2023)
  • Tempe, AZ (US) (2021 - 2023)

Company Filing History:

goldMedal11 out of 56,365 
 
Intel Corporation
 patents

Years Active: 2016-2023

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11 patents (USPTO):Explore Patents
1. 11676873 - Semiconductor package having sealant bridge (2023-06-13),
2. 11652018 - Heat spreader edge standoffs for managing bondline thickness in microelectronic packages (2023-05-16),
3. 11062970 - Heat spreader edge standoffs for managing bondline thickness in microelectronic packages (2021-07-13),
4. 10643938 - Standoff spacers for managing bondline thickness in microelectronic packages (2020-05-05),
5. 10580717 - Multiple-chip package with multiple thermal interface materials (2020-03-03),
6. 9943931 - High performance transient uniform cooling solution for thermal compression bonding process (2018-04-17),
7. 9748199 - Thermal compression bonding process cooling manifold (2017-08-29),
8. 9735089 - Thermal management for flexible integrated circuit packages (2017-08-15),
9. 9548284 - Reduced expansion thermal compression bonding process bond head (2017-01-17),
10. 9434029 - High performance transient uniform cooling solution for thermal compression bonding process (2016-09-06),
11. 9282650 - Thermal compression bonding process cooling manifold (2016-03-08),

Title: Innovator Spotlight: Hemanth K Dhavaleswarapu

Introduction:

Hemanth K Dhavaleswarapu is a prolific inventor based in Chandler, AZ, US, with a remarkable list of 11 patents to his name. His innovative work in the field of semiconductor packaging has significantly contributed to advancements in the technology sector.

Latest Patents:

1. Semiconductor package having sealant bridge: Hemanth's patented technology involves semiconductor packages with a sealant bridge that anchors the integrated heat spreader to the package substrate, reducing thermal degradation and improving overall performance.

2. Heat spreader edge standoffs for managing bondline thickness: Another of his patents focuses on microelectronic packages designed to control bond line thickness between heat dissipation devices and microelectronic devices, enhancing efficiency and functionality.

Career Highlights:

Hemanth K Dhavaleswarapu is a valuable asset to Intel Corporation, where he has made significant contributions to the development of cutting-edge technologies in semiconductor packaging. His expertise and dedication have earned him recognition within the industry.

Collaborations:

Throughout his career, Hemanth has collaborated with industry experts such as Zhihua Li and Joseph B Petrini. Together, they have worked on innovative projects that have pushed the boundaries of semiconductor packaging technology.

Conclusion:

In conclusion, Hemanth K Dhavaleswarapu's passion for innovation and commitment to excellence have established him as a leading figure in the field of semiconductor packaging. His impressive patent portfolio and collaborative spirit continue to drive advancements in technology, shaping the future of the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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