The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2017
Filed:
Dec. 18, 2013
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Pramod Malatkar, Chandler, AZ (US);
Hemanth Dhavaleswarapu, Chandler, AZ (US);
James Neeb, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/603 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); B29L 2031/34 (2013.01); B29L 2031/3425 (2013.01); H01L 2021/603 (2013.01); H01L 2224/75102 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75266 (2013.01); H01L 2224/75301 (2013.01); H01L 2224/75501 (2013.01); H01L 2224/75502 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/0104 (2013.01); H01L 2924/01008 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/0474 (2013.01); H01L 2924/0489 (2013.01); H01L 2924/04894 (2013.01); H01L 2924/05032 (2013.01); H01L 2924/0549 (2013.01); Y10T 29/49826 (2015.01);
Abstract
Embodiments of a thermal compression bonding process bond head and a method for producing a thermal compression bonding process bond head are disclosed. In some embodiments, the bond head includes a thermal compression bonding process heater and a cooling block coupled to the heater through an annular structure. The annular structure surrounds a lower portion of the cooling block and couples the cooling block to the heater such that there is no direct mechanical contact between the cooling block and the heater.