The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2017
Filed:
Dec. 18, 2013
Intel Corporation, Santa Clara, CA (US);
Pramod Malatkar, Chandler, AZ (US);
Hemanth Dhavaleswarapu, Chandler, AZ (US);
James Neeb, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments of a thermal compression bonding process bond head and a method for producing a thermal compression bonding process bond head are disclosed. In some embodiments, the bond head includes a thermal compression bonding process heater and a cooling block coupled to the heater through an annular structure. The annular structure surrounds a lower portion of the cooling block and couples the cooling block to the heater such that there is no direct mechanical contact between the cooling block and the heater.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile